tps658622b www.ti.com slvsaj8 ? september 2010 advanced power management unit check for samples: tps658622b 1 introduction 1.1 main features 1 ? battery charger ? system management ? complete charge management solution for a ? dual-input power path single-cell li-ion/li-pol cell with dynamic ? usb current limiting power management and thermal foldback ? max. 18-v overvoltage protection ? maximum 1-a charge current ? power-good monitoring on all supply ? programmable adapter and usb charge outputs operation ? software reset function ? integrated power supplies ? hardware on/off and reboot control ? 3 programmable step-down converters ? momentary power loss (mpl) handling ? software-controlled enable/forced pwm ? autoboot feature mode ? 11-channel adc with 3 operating modes ? automatic power-saving mode ? single conversion ? maximum 1.5-a outputs (sm0, sm2) ? peak detection ? maximum 2-a output (sm1) ? averaging ? 11 programmable general-purpose ldos ? 7 with output voltages of 1.25 v to 3.3 v 1.2 applications ? 2 with output voltages of 0.725 v to 1.5 v ? smart phones or 1.25 v to 2.586 v (factory configurable) ? portable navigation devices ? 1 always on with output voltages of ? portable media players 1.25 v to 3.3 v ? 1 with output voltage of 1.7 v to 2.475 v ? display support functions ? 4 pwm outputs with programmable frequency and duty cycle ? dual rgb led drivers ? constant-current wled driver ? 26.5 v (max.) at 25 ma ? overvoltage protection ? programmable current-level and brightness control ? host interface ? interrupt controller with maskable interrupts ? external adc triggering and step-down converter mode control 1.3 overview the tps658622b provides an easy-to-use, fully integrated solution for handheld devices, integrating charge management, multiple regulated power supplies, system management, and display functions in a small 6-mm 6-mm package. the i 2 c interface enables control of a wide range of subsystem parameters. internal registers have a complete set of status information, enabling easy diagnostics and host-controlled handling of fault conditions. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2010, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters.
to request a full data sheet, please send an email to: nvidia_contact@list.ti.com .
package option addendum www.ti.com 13-nov-2010 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) tps658622bzqzr active bga microstar junior zqz 120 2500 green (rohs & no sb/br) snagcu level-3-260c-168 hr purchase samples TPS658622BZQZT active bga microstar junior zqz 120 250 green (rohs & no sb/br) snagcu level-3-260c-168 hr contact ti distributor or sales office (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TPS658622BZQZT bga mi crosta r juni or zqz 120 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 q1 package materials information www.ti.com 25-may-2011 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TPS658622BZQZT bga microstar junior zqz 120 250 333.2 345.9 28.6 package materials information www.ti.com 25-may-2011 pack materials-page 2
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" only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer ' s risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications audio www.ti.com/audio communications and telecom www.ti.com/communications amplifiers amplifier.ti.com computers and peripherals www.ti.com/computers data converters dataconverter.ti.com consumer electronics www.ti.com/consumer-apps dlp ? products www.dlp.com energy and lighting www.ti.com/energy dsp dsp.ti.com industrial www.ti.com/industrial clocks and timers www.ti.com/clocks medical www.ti.com/medical interface interface.ti.com security www.ti.com/security logic logic.ti.com space, avionics and defense www.ti.com/space-avionics-defense power mgmt power.ti.com transportation and www.ti.com/automotive automotive microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com wireless www.ti.com/wireless-apps rf/if and zigbee ? solutions www.ti.com/lprf ti e2e community home page e2e.ti.com mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2011, texas instruments incorporated
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